T2M Released Bluetooth 6.3 IP Cores for Licensing
The new radio frequency intellectual property enables high-precision ranging for digital keys and industrial asset tracking.
Updated on Oct. 5, 2026 in Semiconductors
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T2M has announced the availability of its Bluetooth 6.3 radio frequency (RF) IP cores for silicon integration. The technology is designed to support Bluetooth Channel Sounding, which allows for more precise distance measurements.
Why it matters
By facilitating integration into system-on-a-chip (SoC) designs, these IP cores allow manufacturers to incorporate location-based services like asset tracking while improving battery efficiency in congested 2.4 GHz environments.
The cores feature silicon-proven RF architectures optimized for 22 nm ultra-low leakage (ULL) and 40 nm ultra-low power (ULP) process technologies. This design targets operation within the 2.4 GHz frequency band.
The players
T2M
An IP provider and member of the Bluetooth Special Interest Group that supplies hardware designs for system-on-a-chip integration.
The details
T2M utilizes silicon-proven architectures, which are pre-validated circuit designs that reduce the risk of failure during the chip manufacturing process. These IP cores integrate with a modem, controller, and software components to form a complete wireless subsystem on a single chip. This modular approach is designed to simplify the development cycle from initial architecture definition to production bring-up.
Timeline
October 15, 2026: T2M will attend the GlobalFoundries Technology Summit Europe in Munich.
November 19-20, 2026: T2M will attend the ICCAD Expo in Beijing.
The Tech Race
This release expands the market options for implementing the latest Bluetooth Channel Sounding standard. T2M is also positioning its roadmap to eventually include support for Bluetooth High Data Throughput technology.
Manufacturers can now license these cores to build devices that support precise digital keys and industrial automation. End-users will see the benefit as hardware developers integrate these components into consumer and industrial products over the coming product cycles.
The takeaway
The availability of these cores marks a significant step toward the wider adoption of Bluetooth Channel Sounding for proximity sensing. Industry observers should track T2M's upcoming roadmap, which focuses on integrating Bluetooth High Data Throughput capabilities into future IP offerings.
Further reading
For broader trends in chip design and wireless connectivity, see our coverage in Semiconductors.
Source note: This article includes information reported by Design-reuse.
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