Industrial Leaders Dominated Power GaN Patenting in Q2 2026
Patent filings in the second quarter of 2026 highlight a shift toward thermal management and circuitry innovation.
Updated on Oct. 7, 2026 in Semiconductors
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In the second quarter of 2026, roughly 500 patent families were published in the power GaN landscape, with new entrants from China accounting for 70% of the market growth. These filings signify a sustained research effort into gallium nitride power devices, circuits, and packaging solutions.
Why it matters
The concentration of patenting activity in China and the USA underscores the intense global competition to stabilize and integrate wide-bandgap semiconductors for power efficiency. Innovations in thermal management across these filings remain critical for the future of power electronics.
The Q2 2026 data shows 300 patent families were granted for the first time, contributing to 800 new individual patents. Meanwhile, 120 patent families were either abandoned or expired, reflecting high turnover in the power GaN landscape.
The players
Innoscience
A developer of gallium nitride power solutions with a significant patent portfolio in high-performance power devices.
Texas Instruments
A global semiconductor designer and manufacturer with an extensive history in analog and power management ICs.
Samsung
A major electronics and semiconductor manufacturer diversifying its stack into advanced power conversion technologies.
WaveLord
A technology firm specializing in the development of wafer and epitaxial layer fabrication processes for power semiconductors.
Nexperia
A semiconductor manufacturer focused on power discrete components, logic, and MOSFET devices for automotive and industrial markets.
The details
Innovations were primarily directed toward the design of power GaN (gallium nitride — a semiconductor material capable of handling higher voltages and temperatures than silicon) devices and the circuits and applications that utilize them. A consistent technical challenge addressed across wafers, modules, and packaging was thermal management. WaveLord spearheaded activity in wafer and epiwafer technologies, while Nexperia and Mitsubishi Electric led efforts in packaging and module design.
Timeline
Q2 2026: 500 power GaN patent families were published.
The Tech Race
The steady rise in power GaN patenting tracks with the broader industry shift toward wide-bandgap semiconductor adoption for higher power efficiency. This Q2 2026 data set marks a period where industrial incumbents like Texas Instruments and Samsung continue to battle for intellectual property dominance against a massive influx of new market entrants.
The shift toward more robust thermal management and circuit integration in these patents eventually enables more compact and efficient power adapters and automotive chargers. Users should expect these advancements to reach consumer hardware as manufacturers integrate the newly patented device packaging and circuit designs.
The takeaway
The rapid influx of 100 new patent-filing entities suggests a tightening competitive field where thermal management is the primary bottleneck for power density. Watch for whether Chinese market entrants, who make up 70% of new players, transition these patent grants into commercially available power module shipments.
Further reading
For broader trends in component manufacturing, visit Semiconductors.
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