Modder Attached Liquid Cooling to Laptop
A custom 360mm radiator integration slashed operating temperatures by 60°C and boosted gaming performance.
Updated on Oct. 10, 2026 in Computers

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A hardware enthusiast has successfully integrated a 360mm all-in-one (AIO) liquid cooling system into a Metabox P950EP laptop. This DIY modification resulted in significant thermal management improvements, keeping core components well under typical operating temperatures.
Why it matters
This modification demonstrates how aggressive cooling solutions can bypass standard thermal throttling in mobile chassis. By maintaining temperatures below 40°C, the system enables higher sustained clock speeds that stock air-cooling designs cannot achieve.
The system features a 360mm AIO radiator and waterblocks secured via 3D-printed holders, achieving a load temperature below 40°C. Power for the 12v pump and fans is sourced from the laptop’s 19v rail using an integrated DC-DC step-down converter.
The players
Metabox
An Australian manufacturer known for rebranding Clevo ODM chassis for high-performance mobile gaming.
Nvidia
A developer of GPU architectures and mobile graphics hardware, including the GTX 1060 used in this mod.
Intel
A semiconductor manufacturer that designed the Core i7-8750H mobile processor featured in this build.
The details
The modder stripped the existing air-cooling blower fans to mount custom waterblocks onto the Intel Core i7-8750H processor and Nvidia GTX 1060 GPU. These blocks were secured through existing heatpipe mounting holes using 3D-printed brackets and thermal epoxy. To power the external cooling loop, a DC-DC converter was soldered directly to the blower fan contacts, allowing the user to manually toggle the pump and fans via a switch.
Timeline
October 10, 2026: Modification details and performance data were published.
The Tech Race
This DIY project highlights the gap between stock thermal management in mobile Clevo chassis and custom-built liquid cooling arrays. While commercial liquid-cooled laptops exist, they rarely reach the 360mm radiator capacity achieved here.
This modification is not a consumer-ready product but shows the extreme cooling headroom available for those comfortable with soldering and thermal epoxy. Users attempting similar builds will need to account for significant chassis modifications and external power routing.
The takeaway
This build proves that thermal bottlenecks remain the primary limiting factor for mobile gaming performance. Watch for future benchmarks comparing these custom-cooled results against modern laptop thermal management technologies.
Further reading
For more on experimental hardware modifications and mobile performance, see our coverage in Computers.
Source note: This article includes information reported by Tom's Hardware.
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