Bitzer Will Debut Helicom CS60 Compressor for AI Cooling
The new compressor line supports high-density cooling requirements for modern AI infrastructure beginning this October.
Updated on Oct. 12, 2026 in Data Centers
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Bitzer will debut its Helicom CS60 screw compressor series at the Chillventa exhibition on October 13, 2026. This hardware is engineered to support cooling systems for next-generation AI chips requiring supply temperatures up to 45°C.
Why it matters
As AI workloads push server rack power density higher, data center cooling systems must manage significantly increased thermal loads. The CS60 addresses this shift by accommodating high supply temperatures and integrating with 800 VDC power architectures.
The CS60 series features a motor reaching 4,800rpm and a minimum load operation of 25% capacity, with the CS600 model providing 805m/h displacement at 50Hz. Standard operating limits include 30°C evaporating and 70°C condensing temperatures.
The players
Bitzer
A Germany-based manufacturer specializing in refrigeration and air conditioning compressor technology for industrial and commercial applications.
The details
The system utilizes advanced CFD (computational fluid dynamics) simulations—mathematical modeling used to analyze fluid flows—to optimize the rotor profile for internal geometry. To ensure component longevity, integrated oil connections enable the use of an external pump for stable lubrication. Sensor monitoring is managed via the IQ Module CM-SW-02, which oversees system parameters across the CS600 and CS605 models.
Timeline
October 13, 2026: The Chillventa exhibition begins where the compressor debuts.
The Tech Race
This launch places Bitzer in the competitive market for high-capacity thermal management systems required by next-generation AI processing clusters. It represents a pivot toward equipment that can sustain higher operating temperatures compared to legacy cooling infrastructure.
Data center operators and facility engineers can integrate these compressors into high-density liquid cooling loops supporting AI infrastructure. The system is designed to support R1234ze(E), R513A, and R515B refrigerants for international compatibility.
The takeaway
The move to 45°C supply temperatures indicates a long-term shift in how cooling systems accommodate high-density AI silicon. Monitor the post-exhibition technical specifications for the CS605 model to understand full performance scaling against the CS600 baseline.
Further reading
Explore the evolving standards for thermal management in Data Centers.
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Does making data centers more efficient improve the nation's environmental impact?
