Celestica Released DS6005 Data Center Switch
The new hardware delivers 102.4Tbps capacity through co-packaged optics to meet modern AI networking demands.
Updated on Oct. 12, 2026 in Data Centers

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Celestica has released the DS6005, a data center switch designed for high-density AI environments. This system achieves 102.4Tbps of switching capacity using 64 ports rated at 1.6TbE each.
Why it matters
The DS6005 aims to resolve critical bottlenecks in AI data center networks, specifically targeting improvements in bandwidth density, power efficiency, and signal latency.
The system features 102.4Tbps of total switching capacity built on the Broadcom Tomahawk 6-Davisson ASIC. The device occupies a 1.5OU form factor and incorporates liquid cooling for thermal management.
The players
Celestica
A Toronto-based manufacturer specializing in hardware platforms and electronic manufacturing services for data center and enterprise infrastructure.
Broadcom
A global semiconductor firm providing the high-speed networking chips that serve as the switching fabric for data center hardware.
The details
The DS6005 uses co-packaged optics, a design where optical engines—components that convert electrical signals to light—are placed directly onto the ASIC to reduce signal degradation. The system includes field-replaceable external laser modules to ensure serviceability while maintaining high bandwidth. It is governed by CPO-aware software, which is specialized programming designed to manage the unique heat and connectivity requirements of co-packaged optical components.
Timeline
Celestica introduced the DS6005 switch on October 12, 2026.
The switch will be showcased at the OCP Global Summit from October 12-15, 2026.
The Tech Race
The DS6005 utilizes the Broadcom Tomahawk 6-Davisson architecture to stay competitive in the high-performance networking race. This release places Celestica in direct pursuit of benchmarks set by other vendors integrating 1.6TbE connectivity for massive AI clusters.
This hardware is intended for massive AI data centers rather than individual users or small businesses. Deployment timelines for enterprises will be clarified following the OCP Global Summit showcase.
The takeaway
The DS6005 represents a shift toward co-packaged optics to overcome the physical limits of traditional electrical signaling in high-speed networking. Watch for performance data releases from the OCP Global Summit to see how this architecture performs in non-lab, multi-rack configurations.
Further reading
Learn more about the infrastructure standards defining the next generation of Data Centers.
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