Molex Debuts Solderless RF Connectors for Aerospace Hardware
The new 40 gigahertz connectors replace traditional solder interfaces to improve signal reliability and reduce production time.
Updated on Oct. 16, 2026 in Semiconductors
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Molex has announced new radio frequency component designs and the EasiCoax solderless connector at European Microwave Week. These components are designed to streamline assembly for aerospace and defense hardware.
Why it matters
The integration of multiple functions into single units addresses the aerospace and defense industry’s critical need to reduce size, weight, and power usage. This design approach also increases production speed and hardware reliability by eliminating complex solder-based interfaces.
The EasiCoax connector delivers performance up to 40 gigahertz. This unit achieves lower signal insertion loss by utilizing a single spring-loaded design that enables self-aligned connections within an interposer, effectively removing traditional component interfaces.
The players
Molex
A developer of interconnect components, radio frequency technology, and integrated systems for the aerospace and defense sectors.
Smiths Interconnect
A developer of specialized electronic components for high-reliability applications, including the new EasiCoax connector line.
The details
Designers are moving toward integrating multiple radio frequency functions into a single unit to replace discrete components. The EasiCoax connector — a hardware component that provides a physical link between circuits — uses a spring-loaded design that eliminates the need for soldering. By removing these manual interfaces, designers reduce signal insertion loss — the reduction in power resulting from a device in a transmission line — and mitigate component mismatches that often degrade signal quality.
Timeline
European Microwave Week took place in October 2026.
The Tech Race
This development aligns with the ongoing aerospace effort to optimize size, weight, and power across circuit board designs. It represents a shift from traditional multi-component solder assemblies toward more reliable, integrated hardware architectures.
Aerospace and defense engineers can expect faster assembly workflows due to the elimination of traditional soldering requirements. The new designs are aimed at specialized high-frequency equipment, though specific release dates remain unannounced.
The takeaway
These designs signal a transition toward modular, solderless integration in high-frequency aerospace hardware. Interested engineers should track product catalog updates for availability details and detailed performance benchmarks for the EasiCoax line.
Further reading
For more on high-frequency hardware evolution, visit Semiconductors.
Source note: This article includes information reported by Electronic Specifier.
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