Master Bond Released Acid-Resistant Epoxy System

The new EP62-1HTND adhesive supports applications requiring structural integrity in acidic environments up to 450°F.

Updated on Oct. 1, 2026 in Materials Science

Isometric editorial illustration of a hardened resin disc on a metallic plate, representing industrial-grade adhesive systems.
Master Bond released the EP62-1HTND, a two-component epoxy system engineered to maintain structural integrity under extreme heat and acidic conditions. AI Illustration. Upload story photo >

Master Bond has released the EP62-1HTND, a two-component epoxy system designed for bonding and sealing under extreme thermal and chemical conditions. The material is currently available as a non-drip paste.

Why it matters

This release expands options for industrial applications that require high-temperature tolerance alongside resistance to aggressive chemicals like nitric and sulfuric acid. It addresses the need for sealants that maintain physical stability in harsh, corrosive environments.

The EP62-1HTND exhibits a tensile modulus of 500,000-550,000 psi and a tensile lap shear strength of 2,000-2,200 psi on aluminum. It reaches a Shore D hardness of 80-90, with a mix ratio of 100 parts resin to 5 parts hardener by weight.

The players

Master Bond

A manufacturer specializing in high-performance adhesives, sealants, and coatings for industrial and aerospace applications.

The details

The material functions as a non-drip paste that requires an elevated temperature cure to cross-link its polymer structure. Primary curing involves heating the bond to 176-212°F for 60-70 minutes, or 257°F for 20-30 minutes. An optional post-cure process of 3-5 hours at 212-302°F is required to achieve the material's peak mechanical properties.

Timeline

  1. Master Bond announced the product release on October 1, 2026.

The Tech Race

This release represents a continued effort in material science to optimize polymer cross-linking for extreme industrial environments. It builds on the industry trend of creating specialized, multi-purpose adhesives that must maintain structural integrity under both thermal stress and chemical exposure.

The epoxy is intended for industrial professionals who require structural bonding that can withstand exposure to sulfuric, nitric, and hydrochloric acids. Users should plan for an oven-based curing schedule, as the material does not reach its specified mechanical strength at room temperature.

The takeaway

This development highlights the ongoing shift toward materials that minimize structural failure in corrosive industrial settings. Engineers should review the full curing specifications provided by the manufacturer to determine if this system meets the thermal requirements of their specific application.

Further reading

For more on evolving material capabilities, see Materials Science.

More information

View full technical specifications via the acid resistant adhesives product information portal.

Source note: This article includes information reported by Military & Aerospace Electronics.