AEWIN Showcased Modular AI Servers With Liquid Cooling
The new systems use a modular framework to manage 200kW rack densities for enterprise AI infrastructure.
Updated on Oct. 6, 2026 in Data Centers
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AEWIN Technologies showcased new modular servers based on the Data Center Modular Hardware System (DC-MHS) framework. The unveiled systems utilize two-phase direct liquid cooling to support high-density AI infrastructure.
Why it matters
Enterprises increasingly require higher compute density and rapid connectivity to handle AI workloads. These systems address the thermal management limitations that arise as hardware power consumption reaches new peaks.
The server line supports CPUs and GPUs with up to 600W thermal design power (TDP) per unit. The systems also incorporate the ASPEED AST2700 Baseboard Management Controller (BMC) for remote server monitoring.
The players
AEWIN Technologies
A hardware manufacturer specializing in industrial computing, network security appliances, and modular server solutions for AI and edge infrastructure.
AMD
A semiconductor company that produces the EPYC 9006 series CPUs used as the foundational processing units in the new server portfolio.
ASPEED
A fabless integrated circuit design company that provides the AST2700 baseboard management controller for server system health and security monitoring.
The details
The systems rely on a modular DC-MHS architecture—a standardized design approach that separates compute, storage, and I/O into interchangeable modules. To handle the high thermal output of these chips, AEWIN integrates two-phase direct liquid cooling (2P DLC), where a cooling fluid undergoes a phase change from liquid to vapor to pull heat away from high-power components. The BG48-A20813 model accommodates up to eight dual-width GPUs in a 4U enclosure, while the BG28-A10710 includes four PCIe 6.0 x16 slots.
Timeline
October 6, 2026: AEWIN showcased the new server and cooling solutions.
October 12-15, 2026: AEWIN will exhibit at the OCP Global Summit.
The Tech Race
AEWIN is positioning its hardware within the broader OCP ecosystem, which aims to standardize modular server components across the industry. This move follows the trend of decoupling cooling solutions from the main chassis to support higher power density chips that exceed current air-cooling capabilities.
These systems are targeted at enterprise users and data center operators requiring high-density rack configurations. Buyers should look for future announcements regarding specific lead times and product availability for these configurations.
The takeaway
The move toward 200kW rack density demonstrates the physical limits of current air-cooling in AI-focused facilities. Watch the upcoming OCP Global Summit for further technical benchmarks and real-world deployment data for the DC-MHS series.
Further reading
For more information on the evolving standards for high-density infrastructure, visit our Data Centers section.
More information
View the product specifications on the AEWIN company information website.
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