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Avicena Secured $10 Million to Advance Optical Data Tech

The company has raised $130 million to scale its microLED-based optical connectivity platform for high-speed data transfer.

Updated on Oct. 8, 2026 in Quantum Computing

Isometric editorial illustration of a fiber-optic cable bundle and silicon transceiver chip, representing high-speed optical data transmission technology.
Avicena raised $10 million in funding to accelerate the development of its microLED-based optical interconnect platform for high-performance computing architectures. AI Illustration. Upload story photo >

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Avicena has secured $10 million in funding from Korea-based investor Intervest. This latest investment brings the firm's total capital raised to $130 million, following a $65 million round B funding announced in 2025.

Why it matters

The investment accelerates the development of proprietary optical interconnects designed to overcome bandwidth limitations in high-performance computing. Avicena is currently scaling its platform to support high-throughput data transfer requirements for emerging AI and data center architectures.

The company's latest LightBundle evaluation kit supports data throughput of 1 Tbps. This represents a significant increase over the previous platform version launched in March 2026, which featured 320 microLED data channels operating at 3.5 Gbps.

The players

Avicena

A developer of optical connectivity solutions that uses microLED arrays and fiber optics to replace electrical interconnects in data centers.

Intervest

A Korea-based venture capital firm focused on investments in technology, healthcare, and finance sectors.

The details

Avicena utilizes ASIC-based transceivers—chips that manage signal conversion between electrical and optical formats—integrated with microLED, photodetector, and micro-lens arrays. These components are connected via a multi-core fiber bundle to facilitate high-density data transmission. The architecture aims to replace copper-based interconnects that struggle with distance and power constraints at high bandwidths.

Timeline

  1. 2025: Avicena announced its $65 million round B funding.

  2. March 2026: The company launched its first microLED evaluation platform.

  3. September 2026: Avicena launched a new version of its LightBundle evaluation kit.

  4. October 8, 2026: The company raised $10 million from Intervest.

The Tech Race

Avicena's development of microLED-based optical interconnects follows the industry-wide effort to move beyond copper cabling in data centers. The firm is competing against existing silicon photonics approaches by utilizing a proprietary multi-core fiber bundle strategy to reach 1 Tbps throughput.

This technology is targeted at data center operators and high-performance computing hardware architects rather than individual consumer devices. Users should monitor future announcements regarding the mass production and commercial integration of the LightBundle platform into server-grade infrastructure.

The takeaway

Avicena's recent capital infusion supports the ongoing efforts to solve data center bottlenecks through optical integration. Watch for future benchmarks regarding the power efficiency and latency of the 1 Tbps LightBundle system compared to industry-standard high-speed electrical links.

Further reading

For more developments in high-speed connectivity, see the latest in Quantum Computing.

Source note: This article includes information reported by LEDinside - Let There Be Light with LED | Let There Be Light with LED | Global LED News, Market Intelligence & Research.

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