pSemi Released Front-End Modules to Boost IoT Range
The new 2.4 GHz silicon-on-insulator modules extend wireless connectivity by up to 10x over standalone SoCs.
Updated on Oct. 9, 2026 in Semiconductors
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pSemi Corporation has released two new silicon-on-insulator front-end modules, the PE566212 and PE566213, designed for 2.4 GHz IoT applications. These modules integrate a power amplifier, low noise amplifier, and RF switch into a compact package.
Why it matters
The modules enable longer-range connectivity for standards like Bluetooth, Zigbee, and Thread by providing signal amplification that outperforms standalone system-on-chip hardware. These components are available immediately for device manufacturers looking to improve wireless link budgets.
The modules feature a 1.8 dB receive noise figure at 13 dB of gain and a transmit output power of +20 dBm. They are housed in a 1.8 mm by 1.8 mm by 0.63 mm 14-lead package.
The players
pSemi Corporation
A semiconductor company focused on RF integrated circuits and silicon-on-insulator technology for mobile and IoT connectivity.
The details
These modules utilize a monolithic silicon-on-insulator (SOI) design, a manufacturing process that uses a layered silicon-insulator-silicon substrate to reduce parasitic capacitance and improve energy efficiency. The architecture integrates a power amplifier, which boosts the transmit signal, with a low noise amplifier and an RF switch, which manages the routing between transmit and receive paths. The devices rely on the UltraCMOS+ manufacturing process to maintain high performance in a small footprint.
Timeline
October 9, 2026: pSemi Corporation announced the new front-end modules.
The Tech Race
The modules represent an attempt to overcome the signal limitations inherent in standard system-on-chip transceivers. By shifting RF amplification to a dedicated module, pSemi aims to provide an alternative to the lower-power integrated circuits that currently limit range for small IoT devices.
These modules are available now and are primarily targeted at developers building IoT devices requiring higher transmit power and sensitivity. The hardware allows manufacturers to design products that maintain connections at distances previously unreachable by standalone SoCs.
The takeaway
These front-end modules provide a measurable increase in signal gain and range for small-scale wireless devices. Developers should monitor the integration performance of these modules in current-generation Thread and Zigbee hardware designs.
Further reading
For a broader look at the latest developments in chip manufacturing, visit the Semiconductors section.
More information
View technical specifications for these components on the pSemi 2.4 GHz IoT module product information page.
Source note: This article includes information reported by Microwave Journal.
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