Navitas Developed 24 kW Data Center Power Board
The new single-stage architecture converts 800 VDC to 12 VDC for higher density in AI infrastructure.
Updated on Oct. 12, 2026 in Semiconductors
Live Poll
Do you believe rapid improvements in AI infrastructure efficiency will lead to a more sustainable future?
Navitas Semiconductor has developed a 24 kW power delivery board designed to improve energy efficiency in AI data centers. The board utilizes a single-stage architecture to convert 800 VDC directly into 12 VDC for high-performance computing systems.
Why it matters
The design addresses space and efficiency limitations in current AI infrastructure by eliminating intermediate power conversion stages. This consolidation aims to support the massive power demands of next-generation AI chips while reducing the total board footprint.
The board achieves a power density exceeding 2,000 W/in³ by using 16 GaNFast FETs, each rated at 650 V with 18 mΩ resistance. This configuration enables a 97% target efficiency at full load within a compact 400 mm by 60 mm footprint.
The players
Navitas Semiconductor
A developer of Gallium Nitride power integrated circuits and power systems for data centers and high-performance electronics.
The details
The system replaces traditional power delivery designs by removing the 50 V IBC (Intermediate Bus Converter) power stage. Instead, it employs a stacked half-bridge topology—a circuit arrangement that splits voltage across two switches to handle higher input levels—using Gallium Nitride (GaN) FETs. These semiconductors function as high-speed switches, allowing for a direct 800 VDC to 12 VDC conversion that feeds the voltage regulator module directly.
Timeline
Navitas Semiconductor announced the power delivery board on October 12, 2026.
The board will be showcased at the OCP Global Summit in 2026.
The Tech Race
This design follows the trajectory set by the Open Compute Project, which seeks to standardize hardware efficiency for global data centers. Navitas is positioning this board to compete with traditional silicon-based conversion stages in the race for higher power density.
This power board is an infrastructure-level component and will not be available for retail consumer purchase. Deployment will begin in enterprise-grade AI server racks, where it is intended to simplify power distribution architectures and reduce cooling requirements.
The takeaway
The transition to single-stage power conversion represents a significant shift in how data centers handle high-voltage delivery to AI processors. Watch for the board's performance validation when it is presented at the OCP Global Summit 2026.
Further reading
For more on evolving power delivery trends, browse our coverage of Semiconductors.
Live Poll
Do you believe rapid improvements in AI infrastructure efficiency will lead to a more sustainable future?
