Toshiba Launched High-Power Dual SiC MOSFET Module
The new 3300V module uses silver sintering to enable high-current performance in industrial power systems.
Updated on Oct. 9, 2026 in Semiconductors
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Toshiba has launched the IX800FXF2YMS4, a dual SiC (silicon carbide) MOSFET module designed for industrial power applications. This release expands the company's existing iXPLV package product line to a total of four modules.
Why it matters
The module is engineered to handle large surge currents, providing necessary protection for heavy-duty industrial systems. This development signals a continued push to improve power density and thermal reliability in industrial energy infrastructure.
The IX800FXF2YMS4 features a 300kA2s I2t characteristic and a channel temperature rating of 175°C. Performance metrics include a 1.4V drain-source on-voltage, alongside 185mJ turn-on and 175mJ turn-off switching losses.
The players
Toshiba
A multinational manufacturer focused on power semiconductors, industrial infrastructure, and electronic devices.
The details
The module utilizes third-generation SiC MOSFET chips, which provide improved electrical efficiency compared to traditional silicon alternatives. Heat management is handled by silver sintering, a process where silver particles are bonded together at high temperatures to create a high-conductivity joint. This design reduces both conduction and switching losses, allowing the component to maintain stable operation under significant electrical loads.
Timeline
October 8, 2026: Toshiba officially launched the IX800FXF2YMS4 module.
The Tech Race
This release follows the established design pattern of the iXPLV series to address high-surge requirements in industrial sectors. Toshiba continues to broaden its portfolio of SiC-based power solutions to compete in the high-voltage industrial market.
Industrial power engineers can utilize these modules to build systems that better withstand high surge currents compared to previous designs. The hardware is available as part of the expanded iXPLV lineup for integration into future industrial equipment.
The takeaway
The increased power capacity of the IX800FXF2YMS4 offers a new benchmark for thermal resilience in industrial MOSFET modules. Watch for further additions to the iXPLV lineup as the company continues to scale its SiC offerings.
Further reading
For broader trends in power electronics, visit our Semiconductors section.
Source note: This article includes information reported by DQ.
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