SUSS MicroTec Launched Wafer-Cleaning Product Line
The company entered the wafer-level cleaning market to reduce chemical consumption in semiconductor manufacturing.
Updated on Oct. 13, 2026 in Semiconductors
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SUSS MicroTec has launched its GreenTec Solutions product line, featuring the GT200 system for 200 mm semiconductor wafer cleaning. This release marks the company's entry into the wafer-cleaning sector.
Why it matters
The company aims to capture a portion of the €5.4 billion addressable wafer-cleaning market by utilizing technologies that reduce hazardous acid usage. This expansion leverages SUSS MicroTec's established process expertise to target growth in high-volume production.
The GT200 system supports 200 mm process development and production, utilizing TurbulenStrip and CrustBuster technologies. It integrates batch soaking with single-wafer handling and in-situ UV technology to remove organics.
The players
SUSS MicroTec SE
An equipment manufacturer specializing in lithography, bonding, and now wafer-cleaning platforms for the global semiconductor industry.
The details
The GT200 system combines batch soaking—a method where multiple wafers are submerged simultaneously—with single-wafer handling to effectively strip resist and residue. The process employs in-situ UV technology to break down organic materials, minimizing the need for hazardous acids during cleaning. The platform is specifically engineered for MEMS, RF, Power Device, and CMOS applications.
Timeline
2027: Release of 300 mm high-volume manufacturing wafer-cleaning platform.
2028: Release of 200 mm high-volume manufacturing wafer-cleaning platform.
The Tech Race
SUSS MicroTec is positioning its GreenTec Solutions against the established field of wafer-cleaning providers. The company plans to compete by scaling these technologies into 300 mm and 200 mm high-volume manufacturing platforms by 2028.
The GT200 system is designed for engineers working on MEMS, RF, Power Device, and CMOS applications. By integrating this hardware, manufacturers can replace traditional chemical-intensive cleaning steps with UV-based organic removal.
The takeaway
SUSS MicroTec is pivoting into the wafer-cleaning space to lower the environmental impact of chip manufacturing. Track the company's progress toward their 2027 and 2028 high-volume platform releases for evidence of market adoption.
What happens next
SUSS MicroTec is scheduled to release a 300 mm high-volume manufacturing platform in 2027, followed by a 200 mm high-volume manufacturing platform in 2028.
Further reading
Learn more about the latest equipment trends in Semiconductors.
Source note: This article includes information reported by DQ.
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Should industrial manufacturers prioritize chemical reduction even if it increases the complexity of production equipment?
