ADLINK Launches Industrial AI Development Kit

The I-Pi OSM IMX95 module brings 2 TOPS of AI performance to embedded systems with a 15-year product availability guarantee.

Updated on Oct. 21, 2026 in Semiconductors

Isometric editorial illustration of a rectangular industrial electronic module mounted on a green carrier board, representing embedded AI hardware.
ADLINK released the I-Pi OSM IMX95 industrial AI development kit, featuring a 15-year availability guarantee for long-cycle embedded hardware deployments. AI Illustration. Upload story photo >

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ADLINK has released the I-Pi OSM IMX95, an industrial development kit powered by the NXP i.MX95 processor. The system, which features a 2 TOPS neural processing unit, is now available for $595.

Why it matters

This kit targets the growing market for compact, high-efficiency embedded AI in industrial settings, where long-term hardware reliability is a critical requirement for manufacturers. The 15-year availability guarantee addresses the need for stability in long-cycle industrial deployments.

The module utilizes the NXP i.MX95 SoC, which integrates six Arm Cortex-A55 cores along with dedicated M7 and M33 cores for real-time tasks. Its onboard NPU provides 2 TOPS of performance, supported by 4GB of LPDDR4 memory and 32GB of eMMC storage.

The players

ADLINK

A global manufacturer specializing in edge computing, embedded systems, and industrial AI modules.

NXP

A semiconductor manufacturer that produces the i.MX series of application processors for industrial and automotive markets.

The details

The OSM-IMX95 module conforms to the SGeT OSM 1.2 standard, utilizing a solder-down LGA (Land Grid Array) design. By mounting directly to the carrier board, it eliminates the need for mechanical board-to-board connectors that are prone to failure in vibration-heavy environments. The system boots via a custom Linux BSP based on the Scarthgap release and kernel 6.6, facilitating deployment with standard industrial tools.

Timeline

  1. The I-Pi OSM IMX95 development kit is currently available for purchase.

  2. US and EU orders are estimated to have a lead time of six to eight weeks.

The Tech Race

ADLINK is positioning this module to compete in the standardized small-form-factor industrial market governed by the SGeT OSM 1.2 specification. This approach follows the industry trend of shifting away from proprietary connectors to modular, solder-down hardware to increase physical durability.

Engineers can purchase the $595 kit immediately, though regional fulfillment in the US and EU requires a lead time of six to eight weeks. The platform requires familiarity with the Yocto Linux BSP and NXP-compatible flashing tools for initial configuration.

The takeaway

ADLINK is prioritizing longevity with a 15-year availability commitment, a key metric for industrial procurement teams. Future benchmarks comparing the 2 TOPS NPU performance against alternative Arm-based modules will confirm if this architecture meets the needs of high-density edge AI.

Further reading

For more on the current landscape of edge computing hardware, see our Semiconductors section.

Source note: This article includes information reported by LinuxGizmos.

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Do you trust that long-term availability commitments for specialized industrial hardware modules will be honored?