Bourns Releases New Current Sense Resistor Modules
The CSI2F series integrates temperature feedback to stabilize power measurements in high-thermal environments.
Updated on Oct. 21, 2026 in Semiconductors
Bourns has released its new CSI2F series of current sense resistor modules, featuring four distinct models. These components are designed to deliver continuous power ratings of up to 36 W at a terminal temperature of 125 °C.
Why it matters
The integration of local temperature feedback allows engineers to mitigate the performance fluctuations typically caused by resistive heating in high-power applications. This module series offers design flexibility for power management systems through varied terminal finishes and mounting orientations.
The CSI2F series provides resistance values between 25 and 200 µΩ, supported by an integrated 10 kΩ NTC thermistor. The components are rated for continuous operation at 36 W within an operating temperature range of -40 to +125 °C.
The players
Bourns
An electronics component manufacturer specializing in power management, circuit protection, and sensing technology.
The details
The modules utilize voltage-sense connections to provide real-time local temperature data, which is essential for compensating for shunt resistance shifts caused by heat. An NTC thermistor—a temperature-sensitive resistor that decreases in resistance as temperature rises—is integrated to facilitate this feedback loop. The series supports flexible integration with both horizontal and vertical connector configurations, available in either bare copper or tinned terminal variants.
Timeline
October 21, 2026: Bourns announced the commercial availability of the CSI2F series.
The Tech Race
The CSI2F series competes in the high-power shunt resistor market by addressing the limitations of passive sensing components. This release marks an evolution from traditional, standalone shunt designs toward modules that combine sensing elements with integrated thermal compensation.
Hardware engineers developing high-power applications can utilize these modules immediately to streamline PCB layouts. The series is compatible with varied assembly workflows, supporting both horizontal and vertical mounting as well as copper or tinned terminal requirements.
The takeaway
Designers should monitor technical documentation for thermal coefficients to ensure accurate compensation in their specific circuit designs. Future development in this space is expected to focus on higher power density limits for automotive and industrial power electronics.
Further reading
For broader trends in current sensing hardware, see our coverage of Semiconductors.
