Semiconductor Helium Demand to Hit 2.2 Billion Cubic Feet
The industry faces rising gas requirements as it prepares to launch 108 new fabrication projects by 2028.
Updated on Oct. 21, 2026 in Semiconductors

Live Poll
Will the surge in AI development drive up the long-term price of electronic goods for consumers?
Global semiconductor helium demand is projected to reach 2.2 billion cubic feet by 2028, up from an estimated 1.8 billion cubic feet in 2026. This forecast reflects the industry's rapid expansion and the cooling requirements for high-precision manufacturing.
Why it matters
Rising chip complexity and the addition of 108 new fabrication projects by 2028 are straining supply chains for critical manufacturing gases. As the semiconductor industry scales toward a $2.3 trillion valuation by 2030, managing helium availability becomes a primary operational constraint.
Global semiconductor helium demand is expected to reach 2.2 billion cubic feet by 2028 and 3 billion cubic feet by 2030, an increase from 1.8 billion cubic feet in 2026. This trajectory accompanies the planned launch of 108 new fabrication projects by 2028.
The details
Helium is utilized to maintain thermal control of silicon wafers during high-energy etching and deposition. These processes require atomic layer precision, where helium acts as an inert coolant that prevents heat-related defects. The current demand is driven by the scaling of proprietary AI chips and the increasing number of process steps required for next-generation devices.
Timeline
2026: Global semiconductor helium demand estimated at 1.8 Bcf.
2028: Helium demand projected to reach 2.2 Bcf.
2030: Helium demand projected to reach 3 Bcf.
The Tech Race
The forecast for helium usage aligns with the industry's rapid scaling toward a $2.3 trillion valuation by 2030. This growth path is dictated by the push from cloud service providers and manufacturers to develop proprietary AI chip architectures.
Chip manufacturers and cloud service providers must secure long-term helium contracts to support the upcoming construction of 108 new fabrication facilities. Any supply bottleneck would directly increase manufacturing costs for the next generation of AI and high-performance computing hardware.
The takeaway
The industry's helium requirement is set to nearly double from 2026 to 2030 as manufacturing complexity increases. Industry stakeholders should watch for the completion of the 108 announced fabrication projects to confirm if supply chains can keep pace with these volume projections.
Further reading
For broader trends in chip manufacturing, see our latest coverage on Semiconductors.
Source note: This article includes information reported by Gasworld.
Live Poll
Will the surge in AI development drive up the long-term price of electronic goods for consumers?






