Micro-Epsilon Releases Compact Wafer Thickness Sensor
The 90-degree optical sensor enables precise wafer measurement in space-constrained fabrication environments.
Updated on Oct. 23, 2026 in Semiconductors
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Micro-Epsilon has released the IMP-NIR-TH3/90/IP68, a white light interferometer sensor designed for high-precision thickness measurements in confined spaces. The device is now available for industrial use within semiconductor wafer production lines.
Why it matters
This sensor addresses the challenge of maintaining measurement stability in semiconductor fabrication environments where space is limited and particle contamination is high. Its design facilitates accurate wafer inspection without sacrificing speed or performance in tight, high-debris areas.
The sensor features a 15µm light point diameter and operates at a 6kHz maximum measuring rate. It maintains 1nm signal stability in the z-axis and supports multi-peak measurement of up to 5 layers.
The players
Micro-Epsilon
An industrial manufacturer specializing in non-contact measurement sensors for displacement, temperature, and dimensioning applications.
The details
The sensor utilizes a 90-degree optical beam path to fit into restricted installation zones, an adjustment from standard inline sensors. An integrated air purge device maintains optical clarity by shielding the lens from particles. The system pairs with the IMS5420 controller, which employs a 1,100nm wavelength broadband superluminescent diode to measure wafer thickness.
Timeline
October 23, 2026: The IMP-NIR-TH3/90/IP68 sensor is announced for commercial availability.
The Tech Race
This release expands the integration of the IMS5420 controller platform into physically restricted wafer fabrication environments. It competes with existing inline inspection systems by offering a specialized 90-degree beam architecture.
Production engineers can now integrate wafer measurement tools into machinery where vertical clearance was previously insufficient. The device's IP68-rated stainless steel housing ensures compatibility with harsh production environments without requiring additional protective enclosures.
The takeaway
The IMP-NIR-TH3/90/IP68 demonstrates an increasing shift toward miniaturized, ruggedized sensors for highly sensitive fabrication workflows. Engineers should monitor the integration of this 90-degree sensor into high-throughput production lines to assess its impact on wafer yield efficiency.
Further reading
Explore more developments in wafer inspection technology in our Semiconductors section.
Source note: This article includes information reported by Machinery Market.
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