Onsemi Introduced Embedded Power Platform for Inverters
The architecture aims to boost traction inverter efficiency in electric vehicles by integrating multiple power dies.
Updated on Oct. 12, 2026 in Semiconductors
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On September 16, 2026, onsemi announced its Embedded Power Platform, a packaging technology designed to improve traction inverter efficiency in electrified vehicles. The system is currently in the development phase for future automotive implementation.
Why it matters
By integrating diverse power semiconductors into a single package, the platform increases power density and reduces heat loss. This approach targets the thermal management bottlenecks that currently limit performance in next-generation electric vehicle powertrains.
The architecture delivers a 3-5 times increase in power density compared to standard inverter designs. It achieves this by integrating silicon, silicon carbide, and gallium nitride dies directly into the system.
The players
onsemi
A semiconductor manufacturer specializing in power management, sensing, and signal processing solutions for the automotive and industrial sectors.
Subaru Corporation
A Japanese automotive manufacturer currently evaluating the integration of new power platform architectures for their future electrified vehicle lineups.
The details
The platform functions by replacing high-inductive wire bonds—the thin metallic connectors used to link chips to circuit boards—with precision wafer-level redistribution layers. These redistribution layers allow for more compact electrical connections between silicon, silicon carbide (SiC), and gallium nitride (GaN) components. By including field-effect transistors, drivers, and controllers within a single system, the design reduces parasitic inductance and thermal impedance.
Timeline
On September 16, 2026, onsemi announced the Embedded Power Platform.
The Tech Race
The semiconductor industry is currently shifting toward advanced packaging to overcome the limits of traditional discrete power components. This platform follows the broader trend of adopting wafer-level packaging to maintain efficiency gains in high-voltage electric vehicle systems.
This technology will eventually reach consumers through improved range and efficiency in future electric vehicles. Owners can expect these performance gains as automakers, such as Subaru Corporation, incorporate these compact, high-density power systems into their powertrain designs.
The takeaway
The move toward system-level packaging signals a change in how power electronics are scaled for the automotive market. Watch for future performance benchmarks released by automotive partners regarding real-world heat dissipation improvements in production-ready traction inverters.
Further reading
For more on the latest trends in power management, visit the Semiconductors section.
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