Hanmi Unveiled HBM4 and 2.5D Packaging Equipment
The new systems enable high-speed stacking for next-generation AI processors and memory chips.
Updated on Oct. 14, 2026 in Semiconductors
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Hanmi Semiconductor introduced a suite of five new packaging systems, including the TC Bonder 4 for HBM4 production, at Semicon West 2026. These tools are designed to facilitate the assembly of advanced memory and processor chips required for modern AI workloads.
Why it matters
As global production of HBM4 ramps up, manufacturing equipment capacity has become a critical bottleneck in the AI hardware supply chain. Expanding access to these packaging technologies supports the ongoing surge in domestic semiconductor investment across the United States.
Hanmi introduced five new models, including the TC Bonder 4 for HBM4 stacking and a series of 2.5D packaging systems. These tools utilize silicon interposers—thin silicon layers used to route signals between chips—to integrate GPUs, CPUs, and HBM into a single package.
The players
Hanmi Semiconductor
A specialized manufacturer of semiconductor back-end equipment that developed core micro-saw and thermocompression bonding technologies.
The details
The TC Bonder equipment uses precise heat and pressure to stack multiple memory semiconductors vertically. Additionally, the integrated Micro Saw & Vision Placement process automates the full back-end sequence including cutting, cleaning, drying, inspection, sorting, and loading. The 2.5D technology relies on silicon interposers to densely pack disparate processors and memory components together for high-bandwidth data movement.
Timeline
Hanmi developed the micro-saw technology in 2021.
Semicon West 2026 takes place in San Francisco from October 13-15, 2026.
The Wide TC Bonder is scheduled for market release in 2027.
The Tech Race
The introduction of HBM4-ready equipment marks the latest phase in the competitive race to support high-bandwidth memory scaling. This development follows the trajectory set during the 2024 global transition to HBM3E mass production.
These tools primarily affect chip manufacturers and foundry operators currently scaling up their AI-focused packaging lines in the U.S. While the hardware reaches factories first, the increased capacity aims to alleviate long-term supply constraints for AI-ready server and data center hardware.
The takeaway
Hanmi’s new suite of bonders targets the specialized needs of HBM4 stacking and high-density 2.5D packaging configurations. Industry watchers should track the rollout of the Wide TC Bonder in 2027 as a key indicator of available global capacity for the next generation of AI-focused memory.
What happens next
Market release of the Wide TC Bonder is set for 2027.
Further reading
For broader context on the industry-wide push to expand capacity, visit our Semiconductors section.
Source note: This article includes information reported by 조선일보.
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