Stackpole Electronics Released Aluminum Nitride Resistors
The new RMAN series improves thermal management for industrial and automotive power electronics.
Updated on Oct. 12, 2026 in Semiconductors
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Stackpole Electronics has released its RMAN series of aluminum nitride chip resistors. These components are designed to provide higher power density for industrial and automotive applications.
Why it matters
The RMAN series addresses the demand for effective heat dissipation in compact power electronics. By using an aluminum nitride substrate, these resistors allow for greater thermal efficiency in space-constrained designs.
The 1206 size resistor offers a 2.4 W power rating, while the 2512 size reaches 3.4 W. These figures represent a performance increase in heat dissipation compared to traditional alumina substrates.
The players
Stackpole Electronics
A global manufacturer of resistive components for industrial and automotive sectors with headquarters in Raleigh, N.C.
The details
The RMAN series utilizes thick film technology applied to an aluminum nitride substrate. This material possesses higher thermal conductivity than standard alumina, allowing the component to conduct heat away from the resistive element more effectively. This design minimizes localized heating, enabling engineers to increase power density in compact circuit board layouts.
Timeline
1928: Stackpole Electronics began manufacturing operations.
October 12, 2026: The RMAN series of chip resistors was officially released.
The Tech Race
The RMAN series follows the established trend of replacing alumina with more thermally conductive ceramic materials. It competes in the high-performance segment of the passive component market where heat management remains the primary bottleneck for shrinking power stages.
Engineers designing industrial and automotive power modules can now utilize these resistors to decrease the physical footprint of their circuits. Availability and specific volume pricing for the RMAN series have not been announced.
The takeaway
The move to aluminum nitride reflects the industry-wide effort to cram more power into smaller form factors. Engineers should monitor the thermal stability of these components against their specific operating temperature benchmarks as production scales.
Further reading
For broader trends in thermal management and component design, see Semiconductors.
Source note: This article includes information reported by EEJournal.
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