Biostar Released BIWCL-PAT Industrial Motherboard

The new compact board enables edge AI and automation tasks using Intel Core Series 3 processors.

Updated on Oct. 14, 2026 in Computers

Isometric editorial illustration of a modular circuit board featuring geometric components and clean connector ports, representing industrial hardware technology.
Biostar has launched the BIWCL-PAT industrial motherboard, a compact hardware platform supporting Intel Core Series 3 chips for edge computing applications. AI Illustration. Upload story photo >

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Biostar has released the BIWCL-PAT, a new industrial motherboard designed for edge computing and automation. The board features support for the latest Intel Core Series 3 chips in a compact form factor.

Why it matters

This release provides a small-footprint hardware platform for developers building AIoT, HMI, and POS systems that require modern, high-speed data connectivity in constrained industrial spaces.

The motherboard measures 148 by 102 millimeters and supports up to 64GB of DDR5-6400 RAM. It delivers dual 2.5GbE LAN ports and supports triple display output via HDMI 2.1, DisplayPort 1.4, and LVDS.

The players

Biostar

A hardware manufacturer specializing in industrial motherboards, motherboards for general computing, and specialized IPC hardware.

Intel

A semiconductor company known for designing the x86 architecture and current Core Series 3 processors used in edge computing platforms.

The details

The BIWCL-PAT achieves triple independent display output by multiplexing signals across three dedicated interfaces: HDMI 2.1, DisplayPort 1.4, and LVDS, a standard for flat-panel screen communication. Network flexibility is managed through an onboard SIM slot and an M.2 Key-B slot, which facilitate cellular access for remote edge deployments. Hardware-level security is enforced via an integrated TPM 2.0 module, which provides cryptographic functions for system integrity.

Timeline

  1. October 14, 2026: Biostar introduced the BIWCL-PAT industrial motherboard.

The Tech Race

This motherboard integrates the latest Intel Core Series 3 architecture to compete in the expanding industrial AIoT segment. It marks a push to bring high-bandwidth data handling, such as 2.5GbE networking, into the compact 3.5-inch board form factor.

The board supports Windows 11 IoT Enterprise 24H2 and Ubuntu 24.04, allowing systems engineers to choose between established enterprise and Linux-based deployment environments. Operators can expect these units to function in industrial conditions within a temperature range of 0 to 60 degrees Celsius.

The takeaway

This motherboard offers a high-performance, secure foundation for edge computing environments using the Intel Core Series 3 platform. Watch for upcoming announcements regarding regional pricing and specific availability windows for system integrators.

Further reading

For more on evolving standards for small-form-factor systems, visit the Computers section.

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