Bourns Releases New 1.0 mm Shielded Power Inductors
The series provides high current handling in a low-profile package for compact, high-performance portable electronics.
Updated on Oct. 21, 2026 in Semiconductors
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Bourns has released its SRP201210V series of shielded power inductors, a new component line designed to support high current in compact electronic devices. This series is now available for integration into new hardware designs.
Why it matters
As portable electronics continue to shrink while requiring higher power handling, these components provide engineers with a method to balance strictly limited board space against necessary current capacity.
The inductors feature a maximum height of 1.0 mm and provide inductance values ranging from 0.24 to 0.47 µH. They are specified for an operating temperature range of -55 to +125°C.
The players
Bourns
A global manufacturer of electronic components including sensors, circuit protection, and power management solutions.
The details
The SRP201210V series utilizes a metal-alloy powder core, a material known for its high magnetic permeability and saturation characteristics, which allows for smaller component sizes without sacrificing performance. The magnetically shielded construction traps the magnetic field within the core, preventing electromagnetic interference with nearby circuit traces. This combination supports the high current density required by modern portable power management circuits while maintaining a low-profile physical footprint.
Timeline
October 21, 2026: The SRP201210V series was announced.
The Tech Race
This series marks a further reduction in component height for standard shielded power inductors intended for dense, portable hardware. It directly competes with existing low-profile inductor designs that struggle to maintain high current handling in sub-millimeter heights.
Design engineers can immediately incorporate these 1.0 mm inductors into new portable device architectures that require compact power regulation. The components enable thinner device designs without compromising the thermal stability required for operation between -55 and +125°C.
The takeaway
The SRP201210V series highlights the continued industry trend of cramming higher power densities into smaller physical footprints for mobile hardware. Engineers should watch for future datasheet updates regarding current saturation limits for these specific inductance values.
Further reading
For broader technical developments in this field, visit our Semiconductors section.
Source note: This article includes information reported by Electronic Design.
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