SECO to Debut New 40 TOPS Edge AI Module at Electronica
The module integrates Qualcomm's Hexagon architecture to enable scalable machine learning at the edge starting this November.
Updated on Oct. 21, 2026 in Semiconductors
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SECO is set to showcase its SOM-SMARC-Dragonwing-IQ8 module at the electronica 2026 trade show beginning 10 November 2026. The new module integrates Qualcomm Dragonwing IQ8 Series technology to facilitate edge AI applications.
Why it matters
This module launch provides developers with a standardized path for deploying machine learning models directly on edge hardware. By integrating Qualcomm processing power with software management tools, SECO aims to simplify the scaling of AI workloads across industrial device fleets.
The SOM-SMARC-Dragonwing-IQ8 module achieves 40 TOPS of AI acceleration by utilizing the Qualcomm Hexagon neural processing unit. It is designed to function within the Works with Arduino program, leveraging the Arduino VENTUNO Q for initial prototyping.
The players
SECO
An industrial IoT company that develops embedded computing hardware and software management platforms.
Qualcomm
A semiconductor company known for its Snapdragon mobile processors and Hexagon neural processing unit technology.
The details
The module functions by offloading neural network computations from the general-purpose CPU to the integrated Hexagon neural processing unit, a specialized circuit optimized for high-throughput matrix multiplication. It operates alongside the Clea OS, a software layer that enables device management and security maintenance. Developers can use the Arduino VENTUNO Q to interface with the Dragonwing IQ8 Series silicon, creating a bridge for rapid prototyping before scaling deployments across diverse device fleets via the Clea platform.
Timeline
10 November 2026: Innovation presentation at Edge Lab LIVE!
12 November 2026: Edge deployment presentation at Edge Lab LIVE!
The Tech Race
SECO is positioning its hardware within the growing ecosystem of edge-AI platforms built on the Qualcomm Dragonwing IQ8 Series. This development follows recent trends of integrating proprietary neural processing units into standardized modules to shorten the time-to-market for industrial AI deployments.
Engineers and industrial designers can begin testing the module at electronica 2026 by utilizing the Works with Arduino program. The platform provides a pathway for developers to deploy and scale AI-driven applications directly to edge device fleets.
The takeaway
The trajectory of this technology emphasizes the transition from cloud-based AI to localized hardware acceleration in industrial environments. Developers should track the 10 November 2026 innovation presentation to assess the performance benchmarks for the Dragonwing-IQ8 series in live edge deployments.
Further reading
For broader trends in hardware design, see the latest coverage at Semiconductors.
Source note: This article includes information reported by Embedded Computing Design.
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