TME Adds New Raytac Bluetooth Modules to Catalogue
The new modules integrate wireless radio and processor stacks to simplify development for IoT and low-power hardware.
Updated on Oct. 23, 2026 in Semiconductors
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TME has added a new line of Raytac Bluetooth Low Energy modules to its component catalogue. The units integrate radio functionality and microcontrollers on a single platform to support wireless connectivity.
Why it matters
The inclusion of these modules helps electronics designers reduce RF development complexity and accelerate product development cycles by providing pre-integrated wireless systems.
The modules achieve a maximum receiver sensitivity of -103dBm and operate across a thermal range of -40°C to +105°C. Performance figures include program memory ranging from 192KB to 1.5MB and supply voltages between 1.7V and 5.5V DC.
The players
TME
A global distributor of electronic components, industrial automation, and test equipment.
Raytac
A designer and manufacturer of Bluetooth Low Energy modules based on Nordic Semiconductor wireless system-on-chips.
The details
These modules integrate radio functionality, microcontrollers, and peripheral components onto a single platform, allowing them to support surface mounting on host device printed circuit boards. They utilize Arm Cortex-M4F or Cortex-M33 processor cores and support multiple protocols, including ANT+, Thread, Zigbee, and IEEE 802.15.4. Encryption is managed via the AES-128 standard to ensure secure data transmission across the supported BLE 4.0 through 6.2 versions.
Timeline
TME added the Raytac Bluetooth Low Energy modules to its catalogue on October 23, 2026.
The Tech Race
This development reflects the broader industry shift toward highly integrated wireless modules that consolidate radio and compute stacks. It moves beyond standard Bluetooth capabilities by leveraging architectures like the Nordic nRF54 series to enable high-speed 4Mbps proprietary data transmission.
Electronics designers can now source these modules directly for rapid prototyping and deployment in custom hardware. The hardware supports both integrated and external antenna connections, simplifying the design process for developers working on IoT or low-power wireless devices.
The takeaway
These modules streamline the integration of multi-protocol wireless support, including Thread and Zigbee, into small-form-factor devices. Designers should monitor the TME catalogue for specific stock availability and model-specific lead times for the higher-performance nRF54 variants.
Further reading
Explore the latest component developments in Semiconductors.
Source note: This article includes information reported by Electronics For You - Official Site ElectronicsForU.com.
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