Mouser Adds New 5.1MP BrightSense Image Sensors
The STMicroelectronics sensor lineup now includes bare die options for custom vision hardware integration.
Updated on Oct. 26, 2026 in Semiconductors
Mouser Electronics has added STMicroelectronics BrightSense Vx1943 and Vx5943 image sensors to its global inventory. These 5.1-megapixel sensors are now available for purchase in both packaged and bare die configurations.
Why it matters
The availability of bare die options and specific optical coatings allows engineers to integrate high-resolution sensors into bespoke camera modules. This distribution update provides developers direct access to components designed for both visible and near-infrared spectrum imaging.
The sensors feature 5.1-megapixel CMOS technology in OBGA packages. They are available in variations supporting both color and near-infrared (NIR) imaging or dedicated monochrome imaging across the visible to NIR spectrum.
The players
Mouser Electronics
A global distributor of semiconductors and electronic components that serves design engineers and buyers worldwide.
STMicroelectronics
A semiconductor manufacturer focused on sensors, power components, and automotive integrated circuits.
The details
The BrightSense sensors utilize dual-side antireflective coating to minimize light scattering and improve optical clarity. The bare die availability allows manufacturers to mount the silicon directly onto custom printed circuit boards, reducing module size to fit specific camera housing constraints.
Timeline
October 26, 2026: Official distribution listing confirmed.
The Tech Race
This move expands the footprint of STMicroelectronics in the competitive image sensor market for specialized industrial and vision applications. It follows a trend of component suppliers offering bare die options to compete with integrated camera module manufacturers.
Engineers and hardware developers can immediately source these sensors through standard distribution channels for new product development. The availability of bare die versions specifically benefits teams building custom camera modules where standard OBGA packages are too bulky.
The takeaway
The addition of these sensors provides a new pathway for developers to access 5.1MP CMOS technology for visible and NIR applications. Watch for upcoming sensor integration benchmarks to see how these modules perform compared to existing vision-sensor alternatives.
Further reading
Explore recent advancements in Semiconductors to see how new image sensor architectures are impacting hardware design.
Source note: This article includes information reported by Electropages.
