Myvox to Showcase MEMS Microfan at Electronica 2026
The Swedish startup will present its millimeter-scale active cooling technology to address thermal management in compact devices.
Updated on Oct. 28, 2026 in Semiconductors
Live Poll
Is now the time to prioritize active cooling features when choosing your next electronic devices?
Swedish startup Myvox will showcase its piezoelectric MEMS microfan cooling technology at the upcoming electronica Fast Forward 2026 exhibition. The company, which is currently in the research and development phase, plans to present its hardware to the public in Munich from 10 November to 13 November 2026.
Why it matters
Active cooling remains a critical bottleneck for increasingly dense consumer electronics, as conventional fans often exceed available volumetric constraints. Myvox aims to address this by integrating silicon-based thermal management directly into chip-scale footprints.
The MEMS microfan measures 6.9 by 6.4 by 1.2 millimeters and provides a maximum static pressure of 800 Pascals. This silicon-based component produces 0.6 liters per minute of airflow.
The players
Myvox
A Swedish startup established in 2018 that develops piezoelectric MEMS microfans for thermal management in constrained electronics.
Mattias Holmer
The CEO of Myvox who will present the company's microfan technology at the upcoming electronica industry event.
The details
The technology relies on piezoelectric materials—substances that convert electrical energy into mechanical movement—to actuate silicon membranes. When voltage is applied, these membranes oscillate to displace air. The device is designed to operate in a dual-purpose mode that generates both airflow for cooling and audible sound simultaneously.
Timeline
2018: Myvox was founded in Stockholm, Sweden.
10-13 November 2026: Myvox participates in electronica Fast Forward 2026 at Messe München.
12 November 2026: CEO Mattias Holmer pitches the technology at the exhibition.
The Tech Race
Myvox positions its piezoelectric MEMS microfan within the competitive landscape of miniaturized thermal management solutions for dense electronics. The company is currently demonstrating this technology at the electronica Fast Forward 2026 exhibition to differentiate its approach from conventional, larger-scale cooling fans.
This technology is currently research-stage and not yet available for integration into consumer devices. Once commercialized, these microfans could enable thinner, high-performance electronics by replacing bulky, traditional active cooling systems.
The takeaway
Myvox is working to shrink active cooling components into millimeter-scale silicon packages to fit in modern, high-density devices. Watch for the presentation at electronica Fast Forward 2026 to see if the company provides benchmarks for energy efficiency or thermal performance under load.
What happens next
Myvox will participate in the electronica Fast Forward 2026 exhibition in Munich from 10 November to 13 November 2026, with a formal pitch scheduled for 12 November 2026.
Further reading
For broader trends in device integration, follow our latest coverage on Semiconductors.
More information
Review the company's technical vision at the Myvox company website.
Source note: This article includes information reported by Elektor.
Live Poll
Is now the time to prioritize active cooling features when choosing your next electronic devices?
