ACM Research Upgrades SPM System to Recycle Sulfuric Acid
The new tool maintains 15 nm cleanliness while enabling the recovery of 70% of sulfuric acid used in wafer processing.
Updated on Oct. 22, 2026 in Semiconductors
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ACM Research has introduced an upgraded single-wafer hot sulfuric acid-hydrogen peroxide mixture (SPM) cleaning system designed for high-volume semiconductor manufacturing. The system has been validated by a foundry customer across over 50 process layers, confirming its capability to maintain strict particle control while recycling chemical waste.
Why it matters
This system addresses the manufacturing pressure to meet aggressive cleaning standards while curbing the environmental impact and high cost of heavy sulfuric acid consumption. By integrating chemical recovery directly into the wafer-cleaning process, fabs can improve resource efficiency without compromising yield on advanced nodes.
The system operates at 170°C and achieves a 70% sulfuric acid recycle rate, maintaining particle counts of 15 or fewer at a 15 nm threshold. This performance was verified by a foundry customer across more than 50 distinct process layers.
The players
ACM Research
A Fremont-based supplier of single-wafer cleaning and wet-processing equipment for integrated circuit fabrication.
The details
The system features a proprietary nozzle design that eliminates the need for periodic deionized water chamber cleaning, a standard maintenance step that often introduces contamination risks. By avoiding this frequent chamber flush, the system sustains continuous operation while an enhanced chamber architecture captures and treats used sulfuric acid for reuse. This allows the tool to maintain the high thermal and chemical consistency required for advanced cleaning steps at 15 nm nodes.
Timeline
October 21, 2026: ACM Research announced the enhanced SPM system.
The Tech Race
This development follows an industry-wide push to reduce chemical overhead in high-volume manufacturing environments. It marks a shift from simple waste disposal to integrated recycling, directly competing with legacy cleaning tools that currently require high-volume acid consumption and frequent chamber maintenance.
Foundry operators gain the ability to reduce sulfuric acid consumption by an estimated 400 tons per tool each year, lowering operating costs and waste disposal requirements. This tool is intended for immediate integration into high-volume manufacturing lines that require high-precision cleaning at 15 nm and above.
The takeaway
The system demonstrates that chemical recovery is feasible at the high temperatures required for advanced wafer cleaning without sacrificing particle integrity. Operators should track the adoption rate of these recycle-capable systems as foundries adjust their sustainability KPIs over the next 12 months.
Further reading
For broader trends in wafer fabrication equipment, visit our section on Semiconductors.
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