SECO Launches New 40 TOPS Edge AI Module
The SMARC-compatible module uses Qualcomm hardware to accelerate development for next-generation Physical AI applications.
Updated on Oct. 27, 2026 in Semiconductors
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SECO has released engineering samples of the new SOM-SMARC-Dragonwing-IQ8 module for OEM evaluation. The module utilizes the Qualcomm Dragonwing IQ8 series to enable Edge AI development.
Why it matters
This module provides a platform for developers to build next-generation Physical AI applications, leveraging pre-integrated hardware and software support.
The module delivers 40 TOPS of peak AI acceleration via the Qualcomm Hexagon NPU. Connectivity options include support for Gigabit and 2.5 Gigabit Ethernet, PCIe Gen4, and CAN bus interfaces.
The players
SECO
An Italian designer and manufacturer of embedded systems, industrial computers, and IoT software platforms.
Qualcomm
A global semiconductor and telecommunications equipment company known for its Snapdragon mobile processors and AI hardware.
The details
The SOM-SMARC-Dragonwing-IQ8 is a system-on-module designed for integration into embedded devices. It features specialized interfaces for camera inputs and industrial communication protocols. The platform includes compatibility with the Works with Arduino ecosystem for rapid prototyping and Clea OS for remote device management and software updates.
Timeline
October 27, 2026: SECO announced the availability of engineering samples.
The Tech Race
This release follows the integration trajectory for the Qualcomm Dragonwing IQ8 Series into industrial-grade hardware. It targets the ongoing race among embedded manufacturers to standardize Physical AI capabilities for edge deployment.
Interested OEMs can request engineering samples directly through the SECO website. The platform is intended for professional developers building Edge AI hardware rather than retail end-users.
The takeaway
This module enables the rapid prototyping of AI-heavy edge hardware by combining specialized NPU acceleration with industrial-grade connectivity. Observers should track OEM adoption timelines and subsequent announcements regarding commercial-scale volume availability.
Further reading
For broader trends in embedded computing, visit the Semiconductors section.
Source note: This article includes information reported by Industry Europe.
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