New Connector Combines Signal and Power in One Part
Samtec's AcceleRate mP design packs 64 Gbps signaling and 15 A power blades into a 10 mm stack for high-density boards.
Updated on Nov. 4, 2026 in Data Centers
Samtec has released AcceleRate mP combination signal and power blade connectors with a 10 mm stack height, combining digital signaling and high power in a single connector. The product is announced as released as of November 4, 2026; no shipping or pricing details are stated in the source.
Why it matters
Data center and high-performance computing hardware increasingly needs both high-speed signal integrity and substantial current delivery in tight board space. Combining both functions in one connector reduces the number of separate connectors a board must carry, which is part of the broader push to pack more compute into denser systems.
The connector pairs a six-row open-pin-field grid running up to 64 Gbps PAM4 and 32 Gbps NRZ signaling with power blades rated up to 15 A each at 200 VAC or 283 VDC. These are manufacturer-stated specifications, and the source offers no benchmark comparison against earlier connector generations.
The players
Samtec, Inc.
A U.S.-based connector manufacturer with roughly $1 billion in annual manufacturing revenue and operations in more than 40 international locations, whose AcceleRate mP line targets high-density signal and power integration.
The details
The connector uses an open-pin-field layout, meaning pins are not locked to a fixed fixed assignment, so single-ended signals, differential-pair signals, and lower-speed power can share the same body through specialized pin assignments. Its power blades run parallel to the connector body length rather than perpendicular, a 90° shift from common power systems in the industry. According to Samtec, this placement reduces crowding inside the connector and provides more uniform cooling. Options span 5 mm and 10 mm stack heights, with 4, 6, 8, or 10 high-power blades.
Timeline
November 4, 2026: Samtec announced the release of the AcceleRate mP connectors.
The Tech Race
Connector vendors are competing to consolidate signal and power functions into fewer parts as board density rises in server and networking hardware. Samtec's AcceleRate mP line places its combined design directly in that consolidation trend, though the source does not name specific competing products.
Hardware engineers designing high-density boards can use a single connector for both high-speed signals and up to 15 A per power blade, reducing parts count. The source does not state pricing, lead times, or the first customer segments to receive the product.
The takeaway
Watch for Samtec to publish pricing and availability for the AcceleRate mP line, which the source does not yet provide. Engineers evaluating dense board designs should compare the connector's stated 15 A per blade and 64 Gbps PAM4 figures against their own thermal and signal-integrity requirements before adopting it.
Further reading
For broader context on the hardware packing dense compute into modern facilities, explore our Data Centers coverage.
Source note: This article includes information reported by EEJournal.
