Parker Chomerics Releases New Reusable Thermal Interface

The new thermal pad maintains performance during repeated assembly and disassembly cycles for hardware maintenance.

Updated on Oct. 27, 2026 in Semiconductors

Isometric editorial illustration showing a flexible industrial thermal pad positioned between a metal heatsink and a base component. — Parker Chomerics has introduced the Therm-A-Gap Pad 30RB, an elastic thermal interface material designed to maintain integrity through repeated hardware assembly cycles. AI Illustration. Upload story photo >

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Parker Chomerics has released the Therm-A-Gap Pad 30RB, a thermal interface material designed for electronics requiring frequent maintenance or testing. This product is now available to engineers for use in hardware assemblies that demand repeated compression and disassembly cycles.

Why it matters

Managing heat while allowing for multiple assembly and maintenance cycles remains a major challenge in semiconductor hardware. This material addresses the need for components that retain thermal integrity even after engineers repeatedly break and reform connections during testing or rework.

The pad provides a thermal conductivity of 3.0 W/mK and a thermal impedance of 2.9°C·cm²/W. These figures are measured across a wide operating temperature range of -55°C to 200°C, with volume resistivity rated at 10¹³ Ω·cm.

The players

Parker Chomerics

A division of Parker Hannifin that specializes in thermal management materials, shielding, and interface components for electronics and semiconductor packaging.

The details

The Therm-A-Gap Pad 30RB utilizes an elastic composition designed to recover its shape after repeated compression cycles, ensuring consistent contact between heat sources and heat sinks. The material is naturally tacky on both sides, allowing it to adhere to surfaces during assembly without additional adhesives. It is available in thicknesses from 0.51 mm to 5.08 mm to accommodate varying stack-up tolerances.

November 10-13, 2026: Parker Chomerics will exhibit at electronica 2026 in Munich.

The Tech Race

The development follows a broader trend in semiconductor packaging toward materials that can withstand repeated assembly in high-stakes testing environments. It competes with existing high-durability interface solutions by optimizing the balance between elasticity and thermal conductivity.

Engineers and hardware technicians can integrate this material into systems requiring frequent maintenance, disassembly, or prototyping. The pad is RoHS-compliant and available in standard 228.6 mm x 228.6 mm sheets, though users should confirm current inventory availability with the manufacturer.

The takeaway

This release highlights the growing industry focus on maintainable hardware stacks where thermal performance must persist despite constant physical stress. Watch for potential real-world testing results presented by Parker Chomerics at electronica 2026 in Munich.